PACK EXPO International 2026, one of the industry’s premier events, will bring together manufacturers, suppliers, and industry experts to explore the latest innovations in packaging and processing. Hixson is proud to once again participate in the show, taking place October 18-21 in Chicago.

Visit us at Booth LU-7128 to learn how our integrated team of architects, engineers, and process engineers help manufacturers plan, design, and deliver facilities that support long-term growth and operational success. Whether you’re planning your next capital project or simply exploring what’s possible, we welcome the opportunity to connect.

We look forward to seeing you in Chicago at Booth LU-7128!

(Haven’t registered yet? Use Hixson’s comp code 27R39 for complimentary admission to the show!)